Wireless OEM Design Expo

Semis/MMICs/RFICs
Advancement in wafer densities, lower power platforms, SiGe, silicon-carbide, substrates and densities make a myriad of new semiconductor devices available. These device designs deviate from the traditional design methodologies in wireless systems. These sessions will examine these modern devices and dissect the design parameters around them. The attendee will come away with knowledge of these devices, their design parameters and their role in next-generation wireless devices.

Session Topic: Solutions for Today's Voltage Level Translation Needs
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"Supply voltages continue to migrate to lower nodes to support today’s low-power, high-performance applications. While some devices are capable of running at lower supply nodes, others might not have this capability. To have switching compatibility between these devices, the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translation schemes to interface these devices with one another. Depending on application needs, one approach might be more suitable than the other. This presentation gives an overview of the methods and products used to translate logic levels and explains the advantages and disadvantages of each level-translation solution."

Session Topic: RF Transceiver Selection & System Design
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This presentation will discuss RF front end design options for GSM/GPRS/EDGE handsets including information on key performance metrics, RF integration and the evolution of the RF segment of the handset.

Original broadcast: June 22, 2005

Kevin Walsh
Business Development Manager
RF Micro Devices

Session Topic: Building the Case for Transmit Modules in Cellular Handsets
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In the fiercely competitive GSM phone terminal market, terminal manufacturers have come to expect solutions that expedite their development and cycle times. This, coupled with the new feature-rich handsets with mega-pixel cameras, Bluetooth® technology and multimedia functions, means that designers are demanding more integrated, high-performing modules that consume less board space.

In order to meet the increasingly complex phone terminal designs, component solutions providers are challenged to meet ease-of-use requirements while providing enhanced performance. RF Micro Devices' designers have developed a solution system to meet this challenge using a category of devices known as transmit modules (TxM)

A transmit module (TxM) is a logical extension of power amplifier modules commonly used now in handset design platforms .The TxM combines the integrated power control and PA functionality available today along with harmonic filtering and a front end switch function. These modules are now available for GSM/GMSK technology and will soon be available for GMSK/8PSK. In short, the TxM allows for implementation of two module solutions to complete full radio modem functionality - from baseband output to antenna input. The TxM is another step toward full integration of the GSM radio front end. Early attempts at TxM designs have been replaced by smaller, more refined second generation products that embody all the benefits of TxM technology while meeting the exacting performance and price points required by the GSM industry. This presentation will explore the benefits and tradeoffs of using TxMs in today's GSM world.